87761 Datasheet, PDF

Manufacturer	Part #	Datasheet	Description
Belden Inc.	87761	158Kb/2P	Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP 01-20-2023
Molex Electronics Ltd.	87761-2001	308Kb/5P	2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
	87761-2400	308Kb/5P	2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
	87761-4408	106Kb/3P	2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
	87761-5001	308Kb/5P	2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height
	87761-5021	309Kb/5P	2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
	87761-5022	237Kb/4P	2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height
Belden Inc.	87761.0021000	158Kb/2P	Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP 01-20-2023
	87761.002500	158Kb/2P	Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP 01-20-2023
	87761.0025000	158Kb/2P	Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP 01-20-2023

87761 Datasheet, PDF

Link URL