| Manufacturer | Part # | Datasheet | Description |
 Lapp. |
53350118
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
|
53350147
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
|
53350164
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
|
53350166
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
 Aavid, Thermal Division... |
533501B02552G
|
8Mb/116P |
Channel style heat sink with folded back fins
|
|
533502B02552G
|
8Mb/116P |
Channel style heat sink with folded back fins
|
 Lapp. |
53350680
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
|
53350780
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
|
53350870
|
152Kb/3P |
SKINTOP® DIX-M
08.03.2022 |
 Aavid, Thermal Division... |
533521B02552G
|
8Mb/116P |
Channel style heat sink with folded back fins
|
|
533522B02552G
|
8Mb/116P |
Channel style heat sink with folded back fins
|
 Molex Electronics Ltd. |
53353
|
37Kb/1P |
PCB Headers
10/19/2018 |
|
53353-1071
|
367Kb/5P |
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 7.00 and8.00mm (.276 and .315") Stacking Heights, Lead-free, 10 Circuits
|
|
53353-1671
|
37Kb/1P |
PCB Headers
10/19/2018 |
|
53353-1871
|
368Kb/5P |
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 7.00 and 8.00mm (.276 and .315") Stacking Heights, Lead-free, 18 Circuits
|
|
53353-2071
|
368Kb/5P |
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 7.00 and8.00mm (.276 and .315") Stacking Heights, Lead-free, 20 Circuits
|
|
53353-2871
|
368Kb/5P |
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 7.00 and8.00mm (.276 and .315") Stacking Heights, Lead-free, 28 Circuits
|
|
53353-3071
|
368Kb/5P |
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 7.00 and8.00mm (.276 and .315") Stacking Heights, Lead-free, 30 Circuits
|
|
53353-4071
|
367Kb/5P |
0.80mm (.031") Pitch Header, Surface Mount, Dual Row, Vertical Stacking, 7.00 and8.00mm (.276 and .315") Stacking Heights, Lead-free, 40 Circuits
|
 Festo Corporation. |
533577
|
82Kb/1P |
Interlinking block
|