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Manufacturer Part # Datasheet Description Cooper Bussmann, Inc. C515-800-R 253Kb/2P 5 x 15mm Axial-Leaded, Time-Delay, Glass Tube Fuses Eaton All Rights Reserv... C515-800-R 216Kb/2P 5 mm x 15 mm Axial-leaded, time-delay, glass tube fuses Search Partnumber : Start with "15-800-R" - Total : 100 ( 1/5 Page) Molex Electronics Ltd. 15-80-0061 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 15-80-0061 40Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0063 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating 15-80-0063 40Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0065 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 15-80-0065 51Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0067 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 15-80-0067 40Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating, 3.81mm Inside Shroud to End Circuit Spacing 15-80-0069 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating 15-80-0069 40Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0081 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 15-80-0081 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating 15-80-0081 40Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0083 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating 15-80-0083 40Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0085 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating 15-80-0085 46Kb/2P 2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, 15-80-0087 1Mb/7P 2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating

15-800-R Datasheet, PDF [Distributor]

Distributor Part # Manufacturer Datasheet Description Buy Now Element14 15-80-0141 MOLEX CONNECTOR, HEADER, 14POS, 2ROW, 2.54MM; Pitch Spacing:2.54mm; No. of Contacts:14Contacts; Gender:Hea... 15-80-0345 MOLEX CONNECTOR, HEADER, 34POS, 2ROW, 2.54MM; Pitch Spacing:2.54mm; No. of Contacts:34Contacts; Gender:Hea...

15-800-R Distributor