The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP, and 48-ball µBGA* packages.

■ Flexible SmartVoltage Technology
    - 2.7 V–3.6 V Read/Program/Erase
    - 2.7 V or 1.65 V I/O Option Reduces Overall System Power
    - 12 V for Fast Production Programming
■ High Performance
    - 2.7 V–3.6 V: 90 ns Max Access Time
    - 3.0 V–3.6 V: 80 ns Max Access Time
■ Optimized Architecture for Code Plus Data Storage
    - Eight 8-Kbyte Blocks, Top or Bottom Locations
    - Up to Sixty-Three 64-KB Blocks
    - Fast Program Suspend Capability
    - Fast Erase Suspend Capability
■ Flexible Block Locking
    - Lock/Unlock Any Block
    - Full Protection on Power-Up
    - WP# Pin for Hardware Block Protection
    - VPP = GND Option
    - VCC Lockout Voltage
■ Low Power Consumption
    - 9 mA Typical Read Power
    - 10 µA Typical Standby Power with Automatic Power Savings Feature
■ Extended Temperature Operation
    - –40 °C to +85 °C
■ Easy-12 V
    - Faster Production Programming
    - No Additional System Logic
■ 128-bit Protection Register
    - 64-bit Unique Device Identifier
    - 64-bit User Programmable OTP Cells
■ Extended Cycling Capability
    - Minimum 100,000 Block Erase Cycles
■ Flash Data Integrator Software
    - Flash Memory Manager
    - System Interrupt Manager
    - Supports Parameter Storage, Streaming Data (e.g., voice)
■ Automated Word/Byte Program and Block Erase
    - Command User Interface
    - Status Registers
■ SRAM-Compatible Write Interface
■ Cross-Compatible Command Support
    - Intel Basic Command Set
    - Common Flash Interface
■ x 16 for High Performance
    - 48-Ball µBGA* Package
    - 48-Lead TSOP Package
■ x 8 I/O for Space Savings
    - 48-Ball µBGA* Package
    - 40-Lead TSOP Package
■ 0.25 µ ETOX™ VI Flash Technology