FEATURES

■ For surface mounted applications in order to optimize board space.

■ Low profile package.

■ Built-in strain relief.

■ Glass passivated junction.

■ Low inductance.

■ Excellent clamping capability.

■ Repetition Rate (duty cycle): 0.05%.

■ Fast response time: typically less than 1.0ps from 0 volt to BV min.

■ Typical IR less than 1μA above 10V.

■ High Temperature soldering: 260°C/10 seconds at terminals.

■ Plastic package has Underwriters Laboratory Flammability 94V-O.