State-of-the-Art Advanced BiCMOS
Technology (ABT) WidebusE Design for
2.5-V and 3.3-V Operation and Low Static
Power Dissipation
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V VCC)
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Power Off Disables Outputs, Permitting
Live Insertion
High-Impedance State During Power Up
and Power Down Prevents Driver Conflict
Uses Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
Output Ports Have Equivalent 30-W Series
Resistors, So No External Resistors Are
Required
Auto3-State Eliminates Bus Current
Loading When Output Exceeds VCC + 0.5 V
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model; and Exceeds 1000 V
Using Charged-Device Model, Robotic
Method
Flow-Through Architecture Facilitates
Printed Circuit Board Layout
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Package