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LMZ31710 Datasheet (PDF) - Texas Instruments

LMZ31710 Datasheet PDF - Texas Instruments
Part # LMZ31710
Download  LMZ31710 Download
File Size   1414.3 Kbytes
Page   41 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description LMZ31710 10-A Power Module With 2.95-V to 17-V Input and Current Sharing in QFN Package

LMZ31710 Datasheet (PDF)

Go To PDF Page Download Datasheet
LMZ31710 Datasheet PDF - Texas Instruments

Part # LMZ31710
Download  LMZ31710 Click to download

File Size   1414.3 Kbytes
Page   41 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description LMZ31710 10-A Power Module With 2.95-V to 17-V Input and Current Sharing in QFN Package

LMZ31710 Datasheet (HTML) - Texas Instruments


LMZ31710 Product details

1 Features
1• Complete integrated power solution
– Small footprint, low-profile design
– Pin compatible with LMZ31707 and LMZ31704
– 10-mm × 10-mm × 4.3-mm package
• Efficiencies up to 95%
• Eco-Mode™ and light load efficiency (LLE)
• Wide-output voltage adjust
0.6 V to 5.5 V, With 1% reference accuracy
• Supports parallel operation for higher current
• Optional split power rail allows
input voltage down to 2.95 V
• Adjustable switching frequency
(200 kHz to 1.2 MHz)
• Synchronizes to an external clock
• Provides 180° out-of-phase clock signal
• Adjustable slow start
• Output voltage sequencing and tracking
• Power-good output
• Programmable undervoltage lockout (UVLO)
• Overcurrent and overtemperature protection
• Prebias output start-up
• Operating temperature range: –40°C to +85°C
• Enhanced thermal performance: 13.3°C/W
• Meets EN55022 Class B emissions
- integrated shielded inductor
• Create a custom design using the LMZ31710 with
the WEBENCH® Power Designer

2 Applications
• Broadband and communications infrastructure
• Automated test and medical equipment
• Compact PCI / PCI Express / PXI express
• DSP and FPGA point-of-load applications

3 Description
The LMZ31710 power module is an easy-to-use
integrated power solution that combines a 10-A
DC/DC converter with power MOSFETs, a shielded
inductor, and passives into a low-profile QFN
package. This total power solution allows as few as
three external components and eliminates the loop
compensation and magnetics part selection process.
The 10 × 10 × 4.3 mm QFN package is easy to
solder onto a printed circuit board and allows a
compact point-of-load design. The device achieves
greater than 95% efficiency and excellent power
dissipation capability with a thermal impedance of
13.3°C/W. The LMZ31710 offers the flexibility and the
feature set of a discrete point-of-load design and is
ideal for powering a wide range of ICs and systems.
Advanced packaging technology affords a robust and
reliable power solution compatible with standard QFN
mounting and testing techniques.




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