1 Features
1• Complete Integrated Power Solution;
Smaller than a Discrete Design
• 15 mm × 16 mm × 5.8 mm Package Size
- Pin Compatible with LMZ31520
• Ultra-Fast Load Step Response
• Efficiencies Up To 96%
• Wide-Output Voltage Adjust
0.6 V to 3.6 V, with 1% Reference Accuracy
• Optional Split Power Rails Allows
Input Voltage Down to 3 V
• Selectable Switching Frequency;
(300 kHz to 850 kHz)
• Selectable Slow-Start
• Adjustable Over Current Limit
• Power Good Output
• Output Voltage Sequencing
• Over Temperature Protection
• Pre-bias Output Start-up
• Operating Temperature Range: –40°C to 85°C
• Enhanced Thermal Performance: 8.6°C/W
• Meets EN55022 Class A Emissions
- Integrated Shielded Inductor
• Create a Custom Design Using the LMZ31530
With the WEBENCH® Power Designer

2 Applications
• Broadband and Communications Infrastructure
• DSP and FPGA Point of Load Applications
• High Density Power Systems

3 Description
The LMZ31530 power module is an easy-to-use
integrated power solution that combines a 30-A
DC/DC converter with power MOSFETs, a shielded
inductor, and passives into a low profile, QFN
package. This total power solution allows as few as
three external components and eliminates the loop
compensation and magnetics part selection process.
The 15 × 16 × 5.8 mm, QFN package is easy to
solder onto a printed circuit board and allows a
compact point-of-load design. Achieves greater than
95% efficiency, has ultra-fast load step response and
excellent power dissipation capability with a thermal
impedance of 8.6°C/W. The LMZ31530 offers the
flexibility and the feature-set of a discrete point-ofload
design and is ideal for powering a wide range of
ICs and systems. Advanced packaging technology
affords a robust and reliable power solution
compatible with standard QFN mounting and testing
techniques.