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DP83816EX Datasheet (PDF) - Texas Instruments

DP83816EX Datasheet PDF - Texas Instruments
Part # DP83816EX
Download  DP83816EX Download
File Size   842.9 Kbytes
Page   108 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description DP83816-EX 10/100 Mb/s Integrated PCI Ethernet Media Access Controller and Physical Layer (MacPHYTER-II™) Extended Temperature Range 0oC to 85oC

DP83816EX Datasheet (PDF)

Go To PDF Page Download Datasheet
DP83816EX Datasheet PDF - Texas Instruments

Part # DP83816EX
Download  DP83816EX Click to download

File Size   842.9 Kbytes
Page   108 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description DP83816-EX 10/100 Mb/s Integrated PCI Ethernet Media Access Controller and Physical Layer (MacPHYTER-II™) Extended Temperature Range 0oC to 85oC

DP83816EX Datasheet (HTML) - Texas Instruments


DP83816EX Product details

Features
— IEEE 802.3 Compliant, PCI V2.2 MAC/BIU supports
traditional data rates of 10 Mb/s Ethernet and 100 Mb/s
Fast Ethernet (via internal phy)
— Bus master - burst sizes of up to 128 dwords (512 bytes)
— BIU compliant with PC 97 and PC 98 Hardware Design
Guides, PC 99 Hardware Design Guide draft, ACPI v1.0,
PCI Power Management Specification v1.1, OnNow
Device Class Power Management Reference
Specification - Network Device Class v1.0a
— Wake on LAN (WOL) support compliant with PC98,
PC99, SecureOn, and OnNow, including directed
packets, Magic Packet, VLAN packets, ARP packets,
pattern match packets, and Phy status change
— Clkrun function for PCI Mobile Design Guide
— Virtual LAN (VLAN) and long frame support
— Support for IEEE 802.3x Full duplex flow control
— Extremely flexible Rx packet filtration including: single
address perfect filter with MSb masking, broadcast, 512
entry multicast/unicast hash table, deep packet pattern
matching for up to 4 unique patterns
— Statistics gathered for support of RFC 1213 (MIB II),
RFC 1398 (Ether-like MIB), IEEE 802.3 LME, reducing
CPU overhead for management
— Internal 2 KB Transmit and 2 KB Receive data FIFOs
— Serial EEPROM port with auto-load of configuration data
from EEPROM at power-on
— Flash/PROM interface for remote boot support
— Fully integrated IEEE 802.3/802.3u 3.3V CMOS physical
layer
— IEEE 802.3 10BASE-T transceiver with integrated filters
— IEEE 802.3u 100BASE-TX transceiver
— Fully integrated ANSI X3.263 compliant TP-PMD
physical sublayer with adaptive equalization and
Baseline Wander compensation
— IEEE 802.3u Auto-Negotiation - advertised features
configurable via EEPROM
— Full Duplex support for 10 and 100 Mb/s data rates
— Single 25 MHz reference clock
— 144-pin LQFP package
— Low power 3.3V CMOS design with typical consumption
of 383 mW operating, 297 mW during WOL and 53 mW
during sleep mode
— IEEE 802.3u MII for connecting alternative external
Physical Layer Devices
— 3.3V signalling with 5V tolerant I/O




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