1 Features
1• TX7332 supports:
– 32-channel three-level pulser and active
transmit/receive (T/R) switch
– Very low power on-chip beamforming mode:
– In receive-only mode: 0.45 mW/ch
– In transmit-receive mode: 16.4 mW/ch
– In CW mode: 160 mW/ch
– In global power-down mode: 0.1 mW/ch
• Three-level pulser:
– Maximum output voltage: ±100 V
– Minimum output voltage: ±1 V
– Maximum output current: 1.2 A to 0.3 A
– Maximum clamp current: 0.5 A to 0.12 A
– Second harmonic : –45 dBc at 5 MHz
– CW mode jitter: 100 fs measured from 100 Hz
to 20 kHz
– CW mode close-in phase noise: -154 dBc/Hz
at 1 kHz offset for 5-MHz signal
– –3-dB bandwidth with 2-kΩ || 120-pF load
– 20 MHz (for ±100-V supply)
– 25 MHz (for ±70-V supply)
• Active T/R switch with:
– ON, OFF control signals
– Bandwidth: 50 MHz
– HD2: –50 dBc
– Turnon resistance: 24 Ω
– Turnon time: 0.5 μs
– Turnoff time: 1.75 μs
– Transient glitch: 50 mVPP
• Off-chip beamformer with:
– Jitter cleaning using synchronization feature
– Maximum synchronization clock frequency:
200 MHz
• On-chip beamformer with:
– Delay resolution: one beamformer clock period
– Maximum delay: 213 beamformer clock period
– Maximum beamformer clock speed: 200 MHz
– On-chip RAM to store
– 16 delay profiles
– 32 pattern profiles
• High-speed (100 MHz maximum) 1.8-V and 2.5-V
CMOS serial programming interface
• Automatic thermal shutdown
• No specific power sequencing requirement
• Small package: 260-pin NFBGA (17 mm × 11
mm) with 0.8-mm pitch

2 Applications
• Ultrasound imaging system
• Piezoelectric driver
• In-probe ultrasound imaging

3 Description
The TX7332 is a highly integrated, high-performance
transmitter solution for ultrasound imaging system.
The device has total 32 pulser circuits (PULS), 32
transmit/receive (T/R) switches, and supports both
on-chip and off-chip beamformer (TxBF). The device
also integrates on-chip floating power supplies that
reduce the number of required high voltage power
supplies.