FEATURES
• Fully automated system with fab integration to provide a
complete solution to the customer
• High resolution optics combined with precision
mechanics to transfer smallest LEDs down to 5x5 μm²
• 25x10 mm² field size, 1000 Hz rep rate for highest process
speed
• Double receiver stage for high system for outstanding
system efficiency
• Triple donor stage for RGB generation in one process step
and to minimize loading times and to optimize the die-todie
placing accuracy or single tripod donor stage
to compensate wafer bow
• Outstanding SW features like digital twin and path
planning for process simulation and optimization,
processing according to imported error map

APPLICATIONS
• MicroLED repair process
• Remove defect microLEDs from the EpiWafer or
temporary carrier (substrate must be transparent for
UV light)
• Refill of missing microLED on a temporary carrier or
backplane