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PX3SE Datasheet (PDF) - Rockchip Electronics Co., Ltd

PX3SE Datasheet PDF - Rockchip Electronics Co., Ltd
Part # PX3SE
Download  PX3SE Download
File Size   1839.41 Kbytes
Page   54 Pages
Manufacturer  ROCKCHIP [Rockchip Electronics Co., Ltd]
Direct Link  http://www.rock-chips.com/a/en/index.html
Logo ROCKCHIP - Rockchip Electronics Co., Ltd
Description Rockchip PX3 SE Datasheet

PX3SE Datasheet (PDF)

Go To PDF Page Download Datasheet
PX3SE Datasheet PDF - Rockchip Electronics Co., Ltd

Part # PX3SE
Download  PX3SE Click to download

File Size   1839.41 Kbytes
Page   54 Pages
Manufacturer  ROCKCHIP [Rockchip Electronics Co., Ltd]
Direct Link  http://www.rock-chips.com/a/en/index.html
Logo ROCKCHIP - Rockchip Electronics Co., Ltd
Description Rockchip PX3 SE Datasheet

PX3SE Datasheet (HTML) - Rockchip Electronics Co., Ltd


PX3SE Product details

Chapter 1 Introduction
PX3 SE is a high performance Quad-core application processor. Especially it is a highintegration and cost efficient SOC for 1080P H.265.
Quad-core Cortex-A7 is integrates with separately Neon and FPU coprocessor, also shared
256KB L2 Cache. Mali400 MP2 GPU is embedded to support up to WXGA 1280x800 panel
display.
Lots of high-performance interface to get very flexible solution, such as multi-pipe display
with HDMI1.4, TV Encoder. Crypto hardware is integrated for support security BOOT. 32bits
DDR3/LPDDR2 provides high memory bandwidths for high-performance.
HEVC hardware is integrated for support 1080P H.265 video.

Features
The features listed below which may or may not be present in actual product, may be
subject to the third party licensing requirements. Please contact Rockchip for actual product
feature configurations and licensing requirements.

Microprocessor
 Quad-core ARM Cortex-A7MP Core processor, a high-performance, low-power and
cached application processor
 Full implementation of the ARM architecture v7-A instruction set, ARM Neon Advanced
SIMD (single instruction, multiple data) support for accelerated media and signal
processing computation
 Separately Integrated Neon and FPU per CPU
 32KB/32KB L1 I-Cache/D-Cache per CPU.
 Unified 256KB L2 Cache.

Memory Organization
 Internal on-chip memory
 BootRom
 Internal SRAM
 External off-chip memory①
 DDR3/DDR3L/LPDDR2
 Async/Toggle/SyncNand Flash(include LBA Nand)

Internal Memory
 Internal BootRom
 Size : 16KB
 Support system boot from the following device :
 8bits Async Nand Flash
 8bits toggle Nand Flash
 SPI interface
 eMMC interface
 SDMMC interface
 Support system code download by the following interface:
 USB OTG interface
 Internal SRAM
 Size : 8KB




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