Description

The SOP-8 has been modified through a customized leadframe
for enhanced therma characteristics and multiple-die capability
making it ideal in a variety of power applications. With these
improvements multiple devices can be used in an application
with dramatically reduced board space.The package is designed
for vapor phase,infra redor wave soldering techniques.
Power dissipation of greater than 0.8W is possible in a typical
PCB mount application.

Generation VTechnology
Ultra Low On-Resistance
P-Channel Mosfet
Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
Lead-Free
Features