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LX5530 Datasheet (PDF) - Microsemi Corporation

LX5530 Datasheet PDF - Microsemi Corporation
Part # LX5530
Download  LX5530 Download
File Size   101.3 Kbytes
Page   2 Pages
Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation
Description InGaP HBT 4.5 - 6.0GHz Power Amplifier

LX5530 Datasheet (PDF)

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LX5530 Datasheet PDF - Microsemi Corporation

Part # LX5530
Download  LX5530 Click to download

File Size   101.3 Kbytes
Page   2 Pages
Manufacturer  MICROSEMI [Microsemi Corporation]
Direct Link  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation
Description InGaP HBT 4.5 - 6.0GHz Power Amplifier

LX5530 Datasheet (HTML) - Microsemi Corporation


LX5530 Product details

DESCRIPTION

The LX5530 is a power amplifier optimized for the FCC Unlicensed National Information Infrastructure (U-NII) band, HyperLAN2 and Japan WLAN applications in the 4.9 – 5.9 GHz frequency range. The PA is implemented as a three-stage monolithic microwave integrated circuit (MMIC) with active bias, on-chip input matching and output pre-matching. The device is manufactured with an InGaP/GaAs Heterojunction Bipolar Transistor (HBT) IC process (MOCVD). It operates with a single positive voltage supply of 3 – 5V, with high power gain of up to 33dB. When operated at 5V supply voltage, it provides up to +25dBm linear output power for 802.11a OFDM spectrum mask compliance, and low EVM of 3% for up to +23dBm output power in the 4.9-5.9GHz band.



KEY FEATURES

Broadband 4.9 – 5.9GHz Operation

Advanced InGaP HBT

Single-Polarity 3 – 5V Supply

Power Gain up to ~ 33dB for VC=5V, Icq = 250mA

Power Gain > ~28dB across 4.9- 5.85GHz

OFDM Mask Compliance Power Pout ~ +25dBm over 4.9- 5.85GHz (ACPR ~ -50dBc @ ±30MHz Offset)

Pout up to +23dBm with EVM ~3% (VC = 5V)

EVM < ~2.5% for Pout=+21dBm across 4.9-5.85GHz (VC = 5V)

EVM < ~2.5% for Pout=+19dBm across 4.9-5.85GHz (VC = 4V)

Total Current ~250mA for Pout =+20dBm, Duty Cycle = 99%(VC= 4V)

Complete On-Chip Input Match

Simple Output Match for Optimal Broadband EVM

On-Chip RF Decoupling

Temperature-Compensated On-Chip Output Power Detector with Wide Dynamic Range

Small Footprint: 3x3mm

Low Profile: 0.9mm



APPLICATIONS

FCC U-NII Wireless

IEEE 802.11a

HiperLAN2

5GHz Cordless Phone

IEEE 802.16 WiMAX




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About Microsemi Corporation


Microsemi Corporation was an American company that specialized in the design and manufacture of semiconductor and system solutions.
The company was founded in 1960 and was headquartered in Aliso Viejo, California.
Microsemi provided a wide range of products including analog and mixed-signal integrated circuits, field-programmable gate arrays (FPGAs), power management and control products, and other semiconductor solutions.
The company's products were used in various applications such as defense and security, aerospace and aviation, industrial, and communications.
Microsemi was known for its expertise in semiconductor technology and its ability to deliver high-quality and reliable products to its customers.
In 2018, Microsemi was acquired by Microchip Technology, a leading provider of microcontroller, mixed-signal, analog, and security products.
The Microsemi brand is no longer in use, but its technology and products continue to be a part of Microchip's portfolio.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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