Features
◆ 256K x 36, 512K x 18 memory configurations
◆ Supports high performance system speed - 100 MHz
(7.5 ns Clock-to-Data Access)
◆ ZBTTM Feature - No dead cycles between write and read
cycles
◆ Internally synchronized output buffer enable eliminates the
need to control OE
◆ Single R/W (READ/WRITE) control pin
◆ 4-word burst capability (Interleaved or linear)
◆ Individual byte write (BW1 - BW4) control (May tie active)
◆ Three chip enables for simple depth expansion
◆ 3.3V power supply (±5%)
◆ 3.3V (±5%) I/O Supply (VDDQ)
◆ Power down controlled by ZZ input
◆ Packaged in a JEDEC standard 100-pin plastic thin quad
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
◆ Industrial temperature range (–40°C to +85°C) is available
for selected speeds
◆ Green parts available, see ordering information