• High voltage up to 3000 V
• Typical resistance ratios of 250:1 to a maximum
resistance ratio of 500:1
• Flow solderable
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or
single termination flip chip available
• Suitable for solderable, epoxy bondable, or wire bondable
applications
• Termination material: solder-coated nickel barrier or
solder coated non-magnetic terminations standard; gold,
palladium silver, platinum gold, platinum silver or platinum
palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic
terminations available