| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
87760-1016
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1017
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1046
|
114Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1216
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1217
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1218
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
|
|
87760-1226
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.50mm (.138), Tray, Lead-free
|
|
87760-1236
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
|
|
87760-1268
|
103Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, 12 Circuits, 2.54關m (100關) Tin (Sn) over Nickel Plating, Tray, Lead-free
|
|
87760-1416
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 14 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1417
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1616
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1617
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1618
|
172Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
|
|
87760-1816
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1817
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1818
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 18 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
|
|
87760-2016
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-2017
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-2216
|
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
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