1. General Information

· Product Family: AD8663/AD8667/AD8669 (This indicates there are variations within the product line)
· Data Sheet Revision: Rev. D
· Function: The document provides specifications and typical performance characteristics. It appears to describe operational amplifiers or amplifier circuits.
· Warnings:
* ESD Caution: Contains electrostatic discharge (ESD) precautions.
* Thermal Limits: Stresses beyond absolute maximum ratings can cause permanent damage.

2. Electrical Characteristics (Key Highlights)

· Input Offset Voltage: This is a significant parameter, and several figures illustrate its distribution and variation with common-mode voltage (VCM).
* Figure 5, 8 & 10 show input offset voltage distributions at different supply voltages.
* Figure 7 illustrates input offset voltage vs. common-mode voltage (VCM).
· Offset Voltage Drift: Figure 6 and 9 show offset voltage drift distributions at different temperatures.
· Common-Mode Voltage Range: Several figures specify operating ranges for VCM.
· Supply Voltages: The circuits specified are able to operate over different supply voltages ranging from ±2.5V up to ±16V.
· Input Offset Voltage vs. Common-Mode Voltage (Figure 7 and 10): This shows how the input offset voltage changes as the common-mode voltage is varied.

3. Thermal Information

· θJA (Thermal Resistance Junction-to-Ambient): This indicates how well the device dissipates heat into the surrounding environment. Values are provided for different package types:
* 8-Lead SOIC (R-8): 121 °C/W
* 8-Lead LFCSP (CP-8-13): 751 °C/W
* 8-Lead MSOP (RM-8): 145 °C/W
* 14-Lead SOIC (R-14): 90 °C/W
* 14-Lead TSSOP (RU-14): 180 °C/W
· θJC (Thermal Resistance Junction-to-Case): Provided for the same packages, indicating heat dissipation through the device case.
· Notes on Thermal Resistance: θJA values are for worst-case conditions (surface mount).

4. ESD/Handling

· ESD Caution: Static electricity can damage the device. Follow ESD handling procedures.