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Hello, Please ask a question about ATS-50250P-C2-R0 Datasheet
# Example questions:
➢ What materials are used in the construction of this heat sink, specifically for the interface material and the finish?
➢ What is the height of the heat sink, measured from the base to the top of the fin field?
➢ What range of component heights is this thermal solution designed to accommodate?
# ATS-50250P-C2-R0 - Ultra High Performance BGA Cooling Solution
## Features & Benefits
️· maxiFLOW™ Design: Low-profile, spread fin array for effective convection cooling.
️· maxiGRIP™ Attachment: Steady, even pressure without requiring PCB holes.
️· Compliance: Meets Telcordia GR-63, ETSI 300 019, MIL-STD-810 standards.
️· Thermal Interface Material: Preassembled with high-performance, phase-changing material.
️· Component Compatibility: Designed for components 3-4.5mm in height.
## Product Details
️· Part Number: ATS-50250P-C2-R0
️· Dimensions:
- A: 25 mm
- B: 25 mm
- C: 17.5 mm
- D: 44.9 mm
️· Material:
- Interface: Saint-Gobain C1100F
- Finish: Blue-anodized
️· Substitute Item: ATS-50250P-C1-R0 (utilizes Chomerics T766 phase change material)
## Thermal Performance
️· Air Velocity & Thermal Resistance (°C/W):
| Air Velocity (FT/MIN) | Air Velocity (M/S) | Unducted Flow | Ducted Flow |
|---|---|---|---|
| 200 | 1.0 | 3.9 | 3 |
| 300 | 1.5 | 3.2 | |
| 400 | 2.0 | 2.7 | |
| 500 | 2.5 | 2.5 | |
| 600 | 3.0 | 2.3 | |
| 700 | 3.5 | 2.1 | |
| 800 | 4.0 | 2.0 |
# ATS-50250P-C2-R0 - Ultra High Performance BGA Cooling Solution
## Features & Benefits
️· maxiFLOW™ Design: Low-profile, spread fin array for effective convection cooling.
️· maxiGRIP™ Attachment: Steady, even pressure without requiring PCB holes.
️· Compliance: Meets Telcordia GR-63, ETSI 300 019, MIL-STD-810 standards.
️· Thermal Interface Material: Preassembled with high-performance, phase-changing material.
️· Component Compatibility: Designed for components 3-4.5mm in height.
## Product Details
️· Part Number: ATS-50250P-C2-R0
️· Dimensions:
- A: 25 mm
- B: 25 mm
- C: 17.5 mm
- D: 44.9 mm
️· Material:
- Interface: Saint-Gobain C1100F
- Finish: Blue-anodized
️· Substitute Item: ATS-50250P-C1-R0 (utilizes Chomerics T766 phase change material)
## Thermal Performance
️· Air Velocity & Thermal Resistance (°C/W):
| Air Velocity (FT/MIN) | Air Velocity (M/S) | Unducted Flow | Ducted Flow |
|---|---|---|---|
| 200 | 1.0 | 3.9 | 3 |
| 300 | 1.5 | 3.2 | |
| 400 | 2.0 | 2.7 | |
| 500 | 2.5 | 2.5 | |
| 600 | 3.0 | 2.3 | |
| 700 | 3.5 | 2.1 | |
| 800 | 4.0 | 2.0 |
| Part No. | ATS-50250P-C2-R0 |
| Manufacturer | ATS |
| Size | 308 Kbytes |
| Pages | 1 page |
| Description | Ultra High Performance BGA Cooling |
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